On the afterglow from the receding jet of gamma-ray burst

According to popular progenitor models of gamma-ray bursts, twin jets should be launched by the central engine, with a forward jet moving toward the observer and a receding jet (or the counter jet) moving backwardly. However, in calculating the afterglows, usually only the emission from the forward jet is considered. Here we present a detailed numerical study on the afterglow from the receding jet. Our calculation is based on a generic dynamical description, and includes some delicate ingredients such as the effect of the equal arrival time surface. It is found that the emission from the receding jet is generally rather weak. In radio bands, it usually peaks at a time of $t \geq 1000$ d, with the peak flux nearly 4 orders of magnitude lower than the peak flux of the forward jet. Also, it usually manifests as a short plateau in the total afterglow light curve, but not as an obvious rebrightening as once expected. In optical bands, the contribution from the receding jet is even weaker, with the peak flux being $\sim 8$ orders of magnitude lower than the peak flux of the forward jet. We thus argue that the emission from the receding jet is very difficult to detect. However, in some special cases, i.e., when the circum-burst medium density is very high, or if the parameters of the receding jet is quite different from those of the forward jet, the emission from the receding jet can be significantly enhanced and may still emerge as a marked rebrightening. We suggest that the search for receding jet emission should mostly concentrate on nearby gamma-ray bursts, and the observation campaign should last for at least several hundred days for each event.Comment: A few citations added, together with a few minor revisions, main conclusions unchanged, accepted for publication in A&A, 7 figures, 10 Page

A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer

The objective of this dissertation research is to develop a novel three-dimensional (3-D) wire bondless power module package for silicon carbide (SiC) power devices to achieve a low parasitic inductance and an improved thermal performance. A half-bridge module consisting of 900-V SiC MOSFETs is realized to minimize stray parasitic inductance as well as to provide both vertical and horizontal cooling paths to maximize heat dissipation. The proposed 3-D power module package was designed, simulated, fabricated and tested. In this module, low temperature co-fired ceramic (LTCC) substrate with vias is utilized as an interposer of which both top and bottom sides are used as die attachment surfaces, the SiC MOSFET bare dies are flip-chip attached on the LTCC interposer using nickel-plated copper balls, high horizontally thermal conductive material is integrated into the LTCC interposer to improve its thermal dissipation capability. Hence, the LTCC interposer provides both electrical and thermal routing and the nickel-plated copper balls replace bond wires in conventional planar power module as the electrical interconnections for the SiC power devices. On the other side, direct bond copper (DBC) substrate are used at both top and bottom sides of the 3-D module to achieve electrical path for SiC devices and double-sided cooling. As a result, 3D power routing is achieved to reduce stray inductance, and both vertical and lateral paths are utilized to spread heat generated by the power devices in this compact module architecture. Electrical simulation was performed to extract the parasitic inductances in the 3-D package and compared to other reported module packages. Low loop parasitic inductance of 4.5nH at a frequency of 1MHz is achieved after optimization. Thermal and thermo-mechanical simulations were also conducted to evaluate the thermal performance and mechanical stress of the proposed module structure. The fabrication process flow of the 3-D wire bondless module is developed and presented. The fabricated half-bridge module was evaluated experimentally by double-pulse test and thermal cycling test. Significant reduction in voltage overshoot and ringing was observed during the double-pulse test, and the module shows no degradation after thermal cycling test. To push the double-sided wire-bondless module to higher voltage application, a 3.3-kV SiC double-sided wire-bondless common source module was designed, fabricated, and tested. Electric field simulations were performed considering the associated challenge of increased electric field strength in the higher-voltage wire-bondless module. High voltage blocking test was added to evaluate the high voltage operation capability as well

Sum-of-squares of polynomials approach to nonlinear stability of fluid flows: an example of application

With the goal of providing the first example of application of a recently proposed method, thus demonstrating its ability to give results in principle, global stability of a version of the rotating Couette flow is examined. The flow depends on the Reynolds number and a parameter characterising the magnitude of the Coriolis force. By converting the original Navier-Stokes equations to a finite-dimensional uncertain dynamical system using a partial Galerkin expansion, high-degree polynomial Lyapunov functionals were found by sum-of-squares-of-polynomials optimization. It is demonstrated that the proposed method allows obtaining the exact global stability limit for this flow in a range of values of the parameter characterising the Coriolis force. Outside this range a lower bound for the global stability limit was obtained, which is still better than the energy stability limit. In the course of the study several results meaningful in the context of the method used were also obtained. Overall, the results obtained demonstrate the applicability of the recently proposed approach to global stability of the fluid flows. To the best of our knowledge, it is the first case in which global stability of a fluid flow has been proved by a generic method for the value of a Reynolds number greater than that which could be achieved with the energy stability approach

Benchmarking the Intel®Xeon®Platinum 8160 Processor

This report presents a set of results for different microbenchmarks and applications on the Intel Xeon Platinum8160 Processor, formerly known as Skylake. For simplicity, we will use both Skylake and SKX to refer to this processor. We use the Skylake nodes that will be available in Stampede2. This systemwill provide Intel Knights Landing and Skylake chips interconnected by a 100 Gb/sec Intel Omni-Path (OPA) network with a fat tree topology. The peak performance of the system will be 18 PF.Texas Advanced Computing Center (TACC